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A review of microelectronic film deposition using direct and remote electron-beam-generated plasmas

Date

1990

Authors

Collins, George J., author
Lin, Chongjie, author
Zarnani, Hamid, author
Sheng, Tien Yu, author
Luo, Zongnan, author
Zu, Zengqi, author
IEEE, publisher

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Abstract

Soft-vacuum-generated electron beams employed to create a large area plasma for assisting chemical vapor deposition (CVD) of thin films are reviewed. The electron beam plasma is used both directly, where electron impact dissociation of feedstock gases plays a dominant role, and indirectly in a downstream afterglow, where electron impact dissociation of feedstock reactants plays no role. Rather, photodissociation and metastable atom-molecule reactions dominate in the downstream afterglow. To better understand electron-beam-created plasmas using a slotted ring cathode, the transmitted beam spatial intensity profiles have been quantified from initial generation at a slotted line-shaped cold cathode through acceleration in the cathode sheath and propagation in the ambient gas. To better understand the role of photodissociation in downstream plasma-assisted CVD, the VUV output spectrum and VUV generation efficiency from electron-beam-excited plasmas have been measured. The properties of films deposited via both direct electron-beam-generated plasma-assisted CVD and downstream afterglow CVD are reviewed and compared to conventional plasma assisted CVD films.

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Subject

electron beam effects
plasma CVD
plasma CVD coatings
reviews
plasma-beam interactions

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