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Investigation of liquid cooling on M9506A high density Keysight AXIE chassis

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dc.contributor.authorGilvey, Zachary Howard, author
dc.contributor.authorBandhauer, Todd M., advisor
dc.contributor.authorMarchese, Anthony, committee member
dc.contributor.authorSimske, Steve, committee member
dc.date.accessioned2022-01-07T11:28:41Z
dc.date.available2022-01-07T11:28:41Z
dc.date.issued2021
dc.description.abstractForced convection air-cooled heat sinks are the dominant cooling method used in the electronics industry, accounting for 86% of high-density cooling in data centers. However, the continual performance increases of electronics equipment are pushing these air-cooled methods to their limit. Fundamental limitations such as acoustics, cooling power consumption, and heat transfer coefficient are being reached while processor power consumption is steadily rising. In this study, a 4U, 5-slot, high density computing box is studied to determine the maximum heat dissipation in its form factor while operating at an ambient air temperature of 50°C. Two liquid cooling technologies were analyzed in this effort and compared against current state-of-the-art air-cooled systems. A new configuration proposed using return jet impingement with dielectric fluid FC72 directly on the integrated circuit die shows up to a 44% reduction in thermal resistance as compared to current microchannel liquid cooled systems, 0.08 K W-1, vs 0.144 K W-1, respectively. In addition, at high ambient temperatures (~45°C), the radiator of the liquid cooled system accounts for two thirds of the thermal resistance from ambient to junction temperature, indicating that a larger heat exchanger outside the current form factor could increase performance further. The efficiency of the chips was modeled with efficiency predictions based on their junction temperature. On a system level, the model showed that by keeping the chassis at 25°C ambient, the overall power consumption was significantly lower by 500W. Furthermore, the failure rate was accounted for when the chip junction temperature was beyond 75°C. FC72 jet impingement on the die showed the best performance to meet the system cooling requirements and kept the chips below 75°C for the highest ambient temperatures but consumed the most pumping power of all of the fluids and configurations investigated. The configuration with microchannels bypassing TIM 2 showed near the same performance as jet impingement with water on the lid and reduced the junction temperature difference by 5°C when compared to baseline. When the fluid was switched from water to a water glycol 50/50 mixture, an additional thermal resistance of 0.010 K W-1 was recorded at the heat sink level and a higher mass flow rate was required for the GC50/50 heat exchanger to achieve its minimum thermal resistance.
dc.format.mediumborn digital
dc.format.mediummasters theses
dc.identifierGilvey_colostate_0053N_16876.pdf
dc.identifier.urihttps://hdl.handle.net/10217/234169
dc.languageEnglish
dc.language.isoeng
dc.publisherColorado State University. Libraries
dc.relation.ispartof2020-
dc.rightsCopyright and other restrictions may apply. User is responsible for compliance with all applicable laws. For information about copyright law, please see https://libguides.colostate.edu/copyright.
dc.subjectcold plate
dc.subjecthigh performance cooling
dc.subjectmicrochannels
dc.subjectheat sink
dc.subjectadvanced electronics cooling
dc.subjectjet impingement
dc.titleInvestigation of liquid cooling on M9506A high density Keysight AXIE chassis
dc.typeText
dcterms.rights.dplaThis Item is protected by copyright and/or related rights (https://rightsstatements.org/vocab/InC/1.0/). You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).
thesis.degree.disciplineMechanical Engineering
thesis.degree.grantorColorado State University
thesis.degree.levelMasters
thesis.degree.nameMaster of Science (M.S.)

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