Tegethoff, Mick M. V., authorChen, Tom W., authorIEEE, publisher2007-01-032007-01-031996Tegethoff, Mick M. V. and Tom W. Chen, Sensitivity Analysis of Critical Parameters in Board Test, IEEE Design & Test of Computers 13, no. 1 (Spring 1996): 58-63.http://hdl.handle.net/10217/1204The authors analyze the main contributors to the quality and cost of complex boards. With manufacturing data from Hewlett-Packard boards, they use simulation models to derive the sensitivity of quality and cost to the solder defect rate, the functional defect rate, and test coverage. They also give a simple cost estimate of implementing IEEE 1149.1 boundary scan on ASICs. Their new yield model, which accounts for solder defect clustering, provides highly accurate yield predictions.born digitalarticleseng©1996 IEEE.Copyright and other restrictions may apply. User is responsible for compliance with all applicable laws. For information about copyright law, please see https://libguides.colostate.edu/copyright.sensitivity analysisprinted circuitsCADprinted circuit testingText