Anderson, Caleb Del, authorBandhauer, Todd M., advisorVenayagamoorthy, Karan, committee memberWindom, Bret, committee memberWise, Daniel, committee member2024-09-092024-09-092024https://hdl.handle.net/10217/239228Microchannel flow boiling heat transfer offers an effective thermal management solution for high heat flux microelectronic devices such as laser diodes. The high heat transfer rates, nearly isothermal flow conditions, high surface area-to-volume ratios, and lower required pumping powers facilitate smaller component systems while more efficiently cooling devices and reducing packaging stresses associated with thermal expansion when compared with single-phase cooling systems. Although much study has been dedicated to optimizing steady state flow boiling performance, the typically highly transient operation of these microelectronic devices leads to unsteady spikes in heat flux and, subsequently, in device temperatures and may potentially exacerbate flow instabilities present at steady state. The low thermal capacitance of the package that often accompanies the low thermal resistance of microchannel evaporators increases the potential for device damage and failure since large temperature swings are more likely. Predicting and mitigating the transient response of a low thermal resistance microchannel evaporator is paramount to practical application as a thermal management technique. In this work, temperature, pressure, and flow visualization measurements during stepped heat loads on two, low thermal resistance, microchannel evaporators revealed the presence of severe vapor backflow, large temperature overshoots, and impacted flow dynamics at the onset of nucleate boiling (ONB) despite the stability and high performance of the device under steady state heating conditions. These overshoots were exacerbated with higher heating rates and reduced subcooling but were generally improved with higher flow rates. Applying a slower heating rate greatly improved the transient thermal response, reducing both peak temperature and vapor backflow. Channel and inlet orifice geometry were found to greatly impact the performance, with smaller channels and smaller orifice-to-channel restriction ratios resulting in intensified vapor backflow and temperature spikes, despite offering improved steady state performance. A computational model embedded in a reduced order design tool was created and validated with the experiments. Two separate models were created due to the different transient conditions observed between the two tested microchannel evaporators. The models allow predictive modeling of these evaporators to determine the impact of the transient heating behavior on microchannel evaporator devices. The effect of incorporating gallium-based, solid-liquid Phase Change Materials (PCMs) was studied semi-empirically by simulating the performance of a virtual test section with predicted properties of a microchannel evaporator combined with gallium and gallium-composite foam PCMs. Properties of the PCMs were estimated and used to predict the test section thermal response under a range of PCM volumes. Models assuming single phase performance were conducted initially and the resulting predicted heat rate to the fluid applied experimentally to the test section heater to determine the temperature response. It was found that the simulated addition of the PCM slightly reduced the ONB temperatures but did not affect the peak temperature experienced by the device. The applied heating rate, however, did not consider the increased thermal resistance to the refrigerant fluid during the transient vapor backflow regime. The effect was most pronounced in the PCMs with the largest exposed surface area and with thermal conductivity-enhanced PCM composites comprised of gallium infiltrated in a copper foam matrix. Additional PCM models utilizing the transient flow boiling model were subsequently run on a series of representative heat load test cases comparing the performance of a gallium-nickel and gallium-copper composite with similar dimensions to the earlier simulations. Key assumptions included the same ONB temperatures and vapor backflow conditions as the baseline cases without PCMs. The models predicted significantly lowered peak device temperatures due to the heat absorption into the PCM during the transient vapor backflow phase. The effect was dependent on the PCM thickness, latent heat, and thermal conductivity, reflecting trade-offs in material. In addition, peak temperature variability observed experimentally across multiple trials at the same nominal testing conditions was greatly reduced with the inclusion of a PCM.born digitaldoctoral dissertationsengCopyright and other restrictions may apply. User is responsible for compliance with all applicable laws. For information about copyright law, please see https://libguides.colostate.edu/copyright.high heat flux thermal managementphase change materialstwo-phase coolingmicrochannel flow boilingembedded coolingtransient heatingText