Theses and Dissertations
Permanent URI for this collection
Browse
Browsing Theses and Dissertations by Subject "ablation"
Now showing 1 - 2 of 2
Results Per Page
Sort Options
Item Open Access Nanometer-scale machining with extreme ultraviolet lasers(Colorado State University. Libraries, 2013) Bravo, Herman, author; Yalin, Azer, advisor; Rocca, Jorge J., advisor; Marconi, Mario, committee memberThis thesis demonstrates the feasibility of direct machining in the nanometer scale using Extreme Ultraviolet (EUV) laser radiation. Laser machining of materials has been widely used for the development of micromechanical components and devices. Advances in technology further motivate the extension of laser machining of microstructures to smaller dimensions. The advent of high repetition rate table top EUV lasers has opened the possibility of extending laser machining to the nanometer-scale. It has been previously demonstrated that single laser shots from a 46.9 nm wavelength capillary discharge laser can ablate very clean holes with a diameter as small as 82 nm on polymethyl methacrylate (PMMA) photoresist. This thesis extends previous work by demonstrating nanometer-scale machining of polymers with a focused EUV laser beam. Sub-200 nm wide trenches several micrometers in length were machined on PMMA. These are,to our knowledge, the smallest ablated trenches machined with a focused laser beam. This work also discusses the study of warm plasmas created by EUV laser irradiation of solid targets in which single-photon photoionization is the dominant energy absorption mechanisms. Low-absorption (silicon, Z=14) and high-absorption (chromium, Z=24, and silver, Z=47) targets were heated by ~ 1 ns duration pulses from a 46.9 nm wavelength EUV laser. The spectra obtained agree with 1 1/2 dimension simulations in showing that the Si plasmas are significantly colder and less ionized, confirming that in contrast to plasmas created by optical lasers the plasma properties are largely determined by the absorption coefficient of the target material.Item Open Access Selective removal of fluorinated tin oxide (SnO2:F) from Pilkington TEC glass(Colorado State University. Libraries, 2017) Rekow, Mathew, author; Sampath, Walajabad, advisor; Sites, James, committee member; Radford, Don, committee memberHigh power lasers are utilized in a variety of processes in solar energy production and energy storage. In the production of CdTe (Cadmium Telluride) solar cells, pulse lasers are used for the so called P1 scribe step that is the first step in process of creating discrete series connected cells on an otherwise monolithic glass panel. A standard laser process sequence is well established in the industry. The common P1 process step removes all previously deposited materials, resulting in exposure of the soda lime glass substrate along the scribe line. These previously deposited layers include three layers deposited during the fabrication of the glass panel, an intrinsic SnO2 layer, a SiO2 layer, and the conductive SnO2:F layer, the latter of which forms the transparent conductive front contact of the solar cell. If the CdTe film is applied immediately afterward, sodium diffuses from the glass into the deposited CdTe film and is detrimental to the performance of the CdTe solar cell (1). To mitigate this problem, commercial processes perform the P1 scribe after CdTe deposition and the resulting groove is filled with a photo-resist. This photo-resist application process accounts for a significant fraction of the capital equipment cost in a CdTe solar panel production line (2). A means of creating a Na barrier layer in situ would eliminate the requirement of the photo-resist application step and simplify the production process. This work is aimed at developing a laser based scribe process that removes the SnO2:F layer but preserves the intrinsic SnO2 layer and the SiO2 layer to serve as a barrier to Na diffusion and hence eliminate the need for the photoresist application step. During this work, a very unusual laser-material interaction was discovered where the laser appears to initiate a physical – chemical reaction that proceeds along an unusual and apparently undescribed pathway that has many of the characteristics of an etch process. This laser "etching" mechanism allows arbitrary reduction of the film thickness in a controlled manner on the scale of a few microns. In addition to the fine depth selection, we find that there develops a laser pulse duration dependent microstructure on the surface. The unusual characteristics of this interaction are examined and a physical model is proposed to describe it. Finally, sodium diffusion effects were measured and other potential applications of this novel process are explored.